The Sanand OSAT, established under the government’s India Semiconductor Mission 1.0 (ISM), represents one of the first tangible outputs of India’s push to build a self-reliant semiconductor ecosystem.
Aditya Infotech’s CP Plus plans to manufacture 90 lakh CCTV IP cameras over the next three years using chips designed by indigenous company L&T Semiconductor Technologies, a statement said on ...
Dublin, Oct. 09, 2025 (GLOBE NEWSWIRE) -- The "Automotive Radio Frequency System-on-Chip (RF SoC) and Module Research Report, 2025" report has been added to ResearchAndMarkets.com's offering.
Electronic System Design (ESD) industry revenue increased 8.6% to $5,089.4 million in the second quarter of 2025 from the $4,685.5 million registered in the second quarter of 2024, the ESD Alliance, a ...
PORTLAND, Ore., Oct. 8, 2025 /PRNewswire/ -- A major driver for the AI chip market is the exponential growth in data generation and the rising adoption of artificial intelligence across industries.
Currently, intelligent cockpits are evolving from "functional integration" to "emotional and personalized" experiences. As an AI platform enterprise that combines hardware engineering and ...
Anxiety affects the entire body, not just the mind. This widespread condition can lead to serious long-term health problems. Globally, millions suffer from anxiety disorders, but many do not receive ...
I maintain a Hold rating on Synopsys, Inc. due to high valuation, increased debt, and thin free cash flow yield despite the recent selloff. While demand for design automation remains strong and the ...
Apple supplier TSMC is anticipated to start full-scale production of 2-nanometer chips by the end of 2025, with Apple apparently occupying close to half of the total manufacturing capacity. The move ...
The majority of modern GM vehicles are equipped with a roof-mounted communications fin antenna, often referred to as a “sharkfin.” Normally hidden beneath a sleek plastic cover, these components play ...
TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration called ...