Semiconductor Engineering

Improving Test Coverage And Eliminating Test Escapes Using Analog Defect Analysis

While the analog and mixed-signal components are the leading source of test escapes that result in field failures, the lack of tools to analyze the test coverage during design has made it difficult ...
Semiconductor Engineering

Standardizing Defect Coverage In Analog/Mixed Signal Test

A newly drafted IEEE standard will bring more consistency to defect metrics in analog/mixed (AMS) designs, a long-overdue step that has become too difficult to ignore in the costly heterogeneous ...
EDN

Test methods identify small delay defects

Today's systematic and more subtle random defects are not only decreasing yields, but are also increasing the number of test escapes, or defective parts per million (DPPM) shipped out. One of the ...
EDN

Ensure FinFET defect coverage with cell-aware test

The size and performance advantages of FinFETs are leading to a general industry adoption of these 3D transistors at the more advanced technology nodes. These complex transistors, however, exacerbate ...
Electronic Design

What’s The Difference Between Traditional And Defect-Simulated Fault Models?

Once IC fabrication is complete, engineers use fault models to create test patterns that detect defects. These fault models are typically abstractions of defect behavior based on our experience and ...