Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today’s high pin count, ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

The first image of AMD's upcoming Socket AM4, the new single platform for its Bristol Ridge and Zen CPU and APU products, has been leaked, revealing a pin-grid array (PGA) design with 1,331 pin ...

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...

Frenchtown, N.J. – Aries Electronics has broadened its line of pin-grid-array zero-insertion-force (ZIF) Test Sockets with a 9 x 9-grid version. The units enable just one socket to handle a full range ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

The motherboard receptacle for Pentium II and III CPUs. Socket 370 accepts a 370-pin PPGA (plastic pin grid array) chip package. Socket 370 chips and motherboards cost less to manufacture than the ...

While there are entire textbooks that cover the topic of BGAs, their use and fanout techniques, the quick overview provided here offers an engineer a good starting point for improving BGA designs. BGA ...