The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

Intel has revealed more details today about its "breakthrough" glass substrate technology - a new way to manufacture processors that promises numerous benefits to todays standard organic substrate ...

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

As a package substrate, the benefits of glass are substantial. It’s extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that’s just for starters.

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

Chiplets and advanced packaging have been on the cutting-edge of electronic technology for a while, but Intel is changing where it might be headed. Today’s organic substrates, like Ajinomoto build-up ...

No matter what, it's clear at this point that the way forward for the semiconductor industry is chiplets, or "tiles" in Intel nomenclature. Piling multiple pieces of a processor onto one package ...

While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...

Glass substrates could be the key to linking up massive multi-chiplet processors of the near(ish) future. When you purchase through links on our site, we may earn an affiliate commission. Here’s how ...

South Korean giants Samsung Electronics and SK Group are "speeding up efforts" to secure future dominance in glass substrates, which would be a "game-changer" for the semiconductor and AI industries.