The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless ...
Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor ...
Medical device designers are at the forefront of a technological renaissance. From wearable monitors and implantable sensors to lab-on-a-chip (LoC) diagnostics, today's medical innovations are more ...
Digital lithography technology (DLT) is promising chipmakers to combine chips with submicron wiring on glass and other large substrates. And this maskless technology is at the center of a strategic ...
3D integrated circuits promise smaller, faster devices with lower power consumption. Vertically stacked 3D integrated circuits also enable novel in-memory and in-sensor computing paradigms and ...
In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...
SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes, heterogeneous ...
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