Toyota used multiphysics software to build a better heat sink for its future hybrid vehicles. • Engineers designed a smaller and moreefficient heat sink to thermally regulate the electronic components ...

COMSOL version 6.0 delivers performance improvements and simplifies simulation of many important applications, such as printed circuit board (PCB) design (pictured). COMSOL Inc. (Burlington, Mass., ...

The stress-from-heat problem involves a tube in a ceramic block. One surface of the block is uniformly heated. A first step of this sequential multiphysics analysis solves for the velocity profile.

COMSOL Multiphysics® version 6.4 introduces new and updated functionality as well as the new Granular Flow Module, based on the discrete element method (DEM), for simulating grain and powder flow. The ...