Sharp are already tipped to be among the companies Nintendo is considering for the 2D/3D display on the upcoming Nintendo 3DS; how interesting would it be if they also supplied the handheld with a ...
3D printing enthusiasts may be interested in a new Bowden 3D printer accessory in the form of Co Print a multi-filament module that can easily be attached to a wide-ranging existing 3D printers ...
Dr. Masahiko Inami, a professor at the University of Tokyo’s Research Center for Advanced Science and Technology, recently tweeted a picture of an incredibly small, homebrewed 3D-tracked sensor module ...
In the video, Erik Barnes shows off the power-efficient, 1-Mpixel, 3D TOF sensor in the company's eval module. The module is built into a custom, handheld capture system. The ADTF3175 chip has 1k × 1k ...
By using advanced "3D stacking" technology, Izmo re-engineered a standard 200mm x 200mm electronics board into a compact 81mm ...
In this webinar, we will share our clinical experiences with RadCalc’s 3D EPID module. Firstly, the commissioning process of this 3D EPID module will be shown, and Wang Ruoxi will demonstrate their in ...
Largan Precision, one of the current suppliers for the iPhone's camera lens component, today confirmed that it will ship lenses for 3D sensing modules in the second half of 2017, suggesting inclusion ...
Analog Devices, Inc. (ADI) has claimed the industry’s first high-resolution, industrial-quality, indirect time-of-flight (iToF) module for 3D depth sensing and vision systems. The ADTF3175 module ...
Domestic researchers have developed a module that can be combined with existing factory production equipment to implement artificial intelligence (AI). When the module is attached, it can autonomously ...
The ultimate 3D display technology, the Star Trek holodeck, was usually wasted on recreation. To think that it could have been used to create monumentally large cellular structures and even individual ...
IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...
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